Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-03-21
2006-03-21
Fiorilla, Chris (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S248000, C156S257000, C029S025010, C427S063000, C427S096100, C427S290000
Reexamination Certificate
active
07014727
ABSTRACT:
A method of forming high resolution electronic circuits (10) on a substrate (12) is provided. The method includes the steps of laminating a dielectric layer (14) on a substrate (12), laser drilling channels (16and18) in the dielectric film (14) and the substrate (12), and filling channels (16and18) with a filler material (20). Further, a release layer (22) is applied to dielectric film layer (14) and filler material (20), the release layer (22) having an adhesive thereon. Release layer (22) is peeled or otherwise removed from substrate (12), leaving filler material (20) formed and shaped on substrate (12), thus producing a high resolution electronic circuit on substrate (12).
REFERENCES:
patent: 3923697 (1975-12-01), Ellis
patent: 3956052 (1976-05-01), Koste et al.
patent: 4336320 (1982-06-01), Cummings et al.
patent: 4417393 (1983-11-01), Becker
patent: 4508753 (1985-04-01), Stepan
patent: 4710253 (1987-12-01), Soszek
patent: 4763403 (1988-08-01), Klein et al.
patent: 4912844 (1990-04-01), Parker
patent: 4959119 (1990-09-01), Lantzer
patent: 5091339 (1992-02-01), Carey
patent: 5233157 (1993-08-01), Schreiber et al.
patent: 5263957 (1993-11-01), Davison
patent: 5422190 (1995-06-01), Alexander
patent: 5466325 (1995-11-01), Mizuno et al.
patent: 5576073 (1996-11-01), Kickelhain
patent: 5609704 (1997-03-01), Hayama et al.
patent: 5666722 (1997-09-01), Tamm et al.
patent: 5882722 (1999-03-01), Kydd
patent: 6036889 (2000-03-01), Kydd
patent: 6143356 (2000-11-01), Jablonski
patent: 6163957 (2000-12-01), Jiang et al.
patent: 6245663 (2001-06-01), Zhao et al.
patent: 6378424 (2002-04-01), Hayama et al.
patent: 6379745 (2002-04-01), Kydd et al.
Vanheusden, et al., “Advanced Materials System for Ultra-Low Temperature, Digital, Direct-Write Technologies”, Direct-Write Technologies for Rapid Prototyping Applications, Academic Press, San Diego, 2002, pp. 123-174.
“Electronic Packaging and Interconnect Handbook”, 1991, pp. 7.1-7.19.
Gordon, legal representative Susan
Kegresse Todd A.
Kydd Paul
Mathews Scott
Wargo Christopher
Chan Sing P.
Fiorilla Chris
Parelec, Inc.
Potomac Photonics, Inc.
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