Method of forming high resolution circuitry by depositing a poly

Details Method of forming high resolution circuitry by depositing a poly Method of forming high resolution circuitry by depositing a poly

1996-06-07

1998-06-30

Lesmes, George F.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430313, 438678, 438674, 438950, 438951, G03C 556

Patent

active

057731985

ABSTRACT:
A method of forming a high resolution metal pattern on a substrate. A temporary polyvinyl alcohol (10) layer underneath the photoresist layer (20) aids in removing the photoresist layer after plating. The photoresist is photodelineated in conventional manner to form a pattern (40). During photodelineation, the developing process for the resist does not completely remove the PVA (45) that lies directly under the removed resist, but instead reveals those portions of the polyvinyl alcohol layer. The substrate is then rinsed in a hot aqueous solution to effect removal of the revealed PVA portions, now exposing portions (40) of the substrate (15). Metal (50) is then electroplated to build up a metal circuitry pattern. The remaining portions of the photoresist and the PVA are then removed by a hot aqueous solution.

REFERENCES:
patent: 3961961 (1976-06-01), Rich
patent: 4193849 (1980-03-01), Sato
patent: 5576147 (1996-11-01), Guckel et al.

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