Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-03-21
2006-03-21
Huynh, Andy (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S022000, C438S024000, C438S117000, C438S124000, C438S125000, C438S126000, C257S625000, C257S706000, C257S707000, C257S712000, C257S796000
Reexamination Certificate
active
07015073
ABSTRACT:
Numerous embodiments of a heat spreader, comprised of a plurality of downset legs, which provides a simple and lower cost method of forming a heat spreader as compared to conventional methods are disclosed, as well as novel apparatus and methods for attaching the heat spreader to a substrate and a secondary device to the heat spreader, are disclosed.
REFERENCES:
patent: 4748538 (1988-05-01), Tsuji
patent: 5949137 (1999-09-01), Domadia et al.
patent: 6191360 (2001-02-01), Tao et al.
patent: 6271058 (2001-08-01), Yoshida
patent: 6462410 (2002-10-01), Novotmy et al.
patent: 6483169 (2002-11-01), Tosaya et al.
patent: 6512675 (2003-01-01), Tarter et al.
patent: 6525420 (2003-02-01), Zuo et al.
patent: 6538320 (2003-03-01), Tosaya et al.
patent: 29914753 (1999-12-01), None
patent: 0359928 (1990-03-01), None
patent: 59188944 (1984-10-01), None
patent: 59188944 (1984-10-01), None
patent: 01191453 (1989-08-01), None
patent: 07183434 (1995-07-01), None
“Surface-Mounted Heat Sink Attach for Tab”,IBM Technical Disclosure Bulletin, IBM Corp., New York, U.S.(vol. 33, No. 3B), (Aug. 1, 1990), 101-103.
Houle Sabina J.
Labanok Nick
Huynh Andy
Schwegman Lundberg Woessner & Kluth P.A.
LandOfFree
Method of forming heat spreader with down set leg attachment... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming heat spreader with down set leg attachment..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming heat spreader with down set leg attachment... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3560066