Method of forming heat spreader with down set leg attachment...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support

Reexamination Certificate

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C438S022000, C438S024000, C438S117000, C438S124000, C438S125000, C438S126000, C257S625000, C257S706000, C257S707000, C257S712000, C257S796000

Reexamination Certificate

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07015073

ABSTRACT:
Numerous embodiments of a heat spreader, comprised of a plurality of downset legs, which provides a simple and lower cost method of forming a heat spreader as compared to conventional methods are disclosed, as well as novel apparatus and methods for attaching the heat spreader to a substrate and a secondary device to the heat spreader, are disclosed.

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“Surface-Mounted Heat Sink Attach for Tab”,IBM Technical Disclosure Bulletin, IBM Corp., New York, U.S.(vol. 33, No. 3B), (Aug. 1, 1990), 101-103.

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