Method of forming grooves in the [011] crystalline direction

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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29580, 29583, 51283, 156645, 156659, H01L 21312

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active

040295311

ABSTRACT:
An A-B etchant is applied to a (100) surface of a body of semiconductor material, a portion of which along the (100) surface of the body is either gallium arsenide or gallium aluminum arsenide. The etchant is applied for at least 15 seconds at a temperature of approximately 80.degree. C. The A-B etchant is a solution by weight percent of 47.5%, water, 0.2% silver nitrate, 23.8% chromium trioxide and 28.5% of a 48% aqueous solution of hydrofluoric acid. As a result of the application of the A-B etchant a pattern of elongated etch pits form having their longitudinal axes along the [011] crystalline direction. Grooves are formed in the body at a surface opposite the (100) surface on which was applied the etchant. The grooves are formed along the [011] crystalline direction by aligning the longitudinal axes of the grooves with the longitudinal axes of the etch pits.

REFERENCES:
patent: 3486892 (1969-12-01), Rosuold
patent: 3765969 (1973-10-01), Kragness et al.
patent: 3920495 (1975-11-01), Roberts
patent: 3959037 (1976-05-01), Gutierrez et al.
Tarui et al., Yasuo, "Preferential Etching and Etched Profile of GaAs," Journal of Electrochemical Society: Solid State Science, Jan. 1971, pp. 118-122.

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