Method of forming groove pattern

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156345, 156664, C23F 102

Patent

active

040212793

ABSTRACT:
A method is given for obtaining recesses in a surface by etching. The obtained surface with recesses can be used for example in bearings.
According to the invention, an etching method is given, wherein the depth of the recesses is controlled by forcing an etching fluid along the surface to be etched by means of a flow guiding template in places defined by this template.
The etching rate in the recesses to be etched is controlled by adjustment of the flow velocity of the etching liquid and the slit height in the flow-guiding template.
The recesses to be etched are deeper when the flow velocity of the etching fluid and the slit height are both higher.

REFERENCES:
patent: 3043362 (1962-07-01), Mennesson
patent: 5751313 (1973-08-01), DiBenedetto et al.

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