Method of forming flat inner lead tips on lead frame

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support

Patent

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Details

29827, H01L21/48

Patent

active

059045035

ABSTRACT:
The invention is a method which deliberately applies exaggerated features (22,32) on the photo-image used to pattern the lead frame for etching. The resulting etched leads (20,25,29) will have a flat to concave shape at the end of the lead tips (23,26,30), which can be used to "self-center" wire bond paths, eliminating the slung wire tendency altogether, provided the wire path crosses the lead tip within the concave shape region.

REFERENCES:
patent: 5683943 (1997-11-01), Yamada

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