Method of forming fine conductive lines, patterns and connectors

Details Method of forming fine conductive lines, patterns and connectors Method of forming fine conductive lines, patterns and connectors

1985-10-28

1987-10-27

Bashore, S. Leon

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156636, 156643, 156645, 156664, 156668, 430313, 430314, C23F 100, H05K 326, H01L 7184

Patent

active

047027924

ABSTRACT:
The present invention discloses a method of forming fine conductive lines, patterns, and connectors, and is particularly useful in the formation of electronic devices. The method comprises a series of steps in which: a polymeric material is applied to a substrate; the polymeric material is patterned to form openings through, spaces within, or combinations thereof in the polymeric material; subsequently, conductive material is applied to the patterned polymeric material, so that it at least fills the openings and spaces existing in the polymeric material; and excess conductive material is removed from the exterior major surface of the polymeric material using chemical-mechanical polishing, to expose at least the exterior major surface of the polymeric material. The structure remaining has a planar exterior surface, wherein the conductive material filling the openings and spaces in the patterned polymeric material becomes features such as fine lines, patterns, and connectors which are surrounded by the polymeric material. The polymeric material may be left in place as an insulator or removed, leaving the conductive features on the substrate.

REFERENCES:
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patent: 4450652 (1984-05-01), Walsh
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patent: 4599136 (1986-07-01), Araps et al.
patent: 4599243 (1986-07-01), Sachdev et al.
Shaw et al., "Photosensitive Glass for Producing Recessed Metallurgy, Eliminating Need for Planarization", IBM TDB vol. 26, No. 3A, p. 1094, Aug. 1983.

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