Method of forming electrode connecting portion

Details Method of forming electrode connecting portion Method of forming electrode connecting portion

2009-09-17

2011-12-13

Wilczewski, Mary (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S612000, C257S737000, C257SE21509

Reexamination Certificate

active

08076233

ABSTRACT:
A manufacturing method for an electrode connecting portion includes covering an electrode forming surface with a solder sheet, rolling a heating roller on the solder sheet that covers the electrode forming surface, and removing the solder sheet after the heating roller has passed over the solder sheet.

REFERENCES:
patent: 4923100 (1990-05-01), Nakamura et al.
patent: 4936504 (1990-06-01), Arai et al.
patent: 6186390 (2001-02-01), Tadauchi et al.
patent: 6386426 (2002-05-01), Tadauchi et al.
patent: 03-234034 (1991-10-01), None
patent: 07-078847 (1995-03-01), None
patent: 08-167612 (1996-06-01), None
patent: 08-203904 (1996-08-01), None
patent: 11-284031 (1999-10-01), None
patent: 2000-114318 (2000-04-01), None
Partial Translation of JP 08-167612 (obtained from PAJ on JPO website on Dec. 17, 2010).

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