Method of forming electrically conductive wiring pattern

Details Method of forming electrically conductive wiring pattern Method of forming electrically conductive wiring pattern

1998-03-02

2000-11-21

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430329, 427 98, G03F 726

Patent

active

061500747

ABSTRACT:
There is provided a method of forming an electrically conductive wiring pattern, including the steps of patterning a resist on a substrate so that the resist has at least one recess where an electrically conductive wiring is to be formed, the substrate appearing in the recess, the resist being composed of silicon dioxide particles having a diameter of 5 .mu.m or smaller and epoxy acrylate having a fluorene skeleton, etching the resist by plasma-ashing so that the silicon dioxide particles appear on a surface of the resist, forming a metal film over both the resist and the substrate appearing in the recess, and removing the metal film formed on the resist by removing the silicon dioxide particles appearing on a surface of the resist. The above-mentioned method provides a fine, highly accurate, electrically conductive wiring pattern without wiring disconnection and short-circuit

REFERENCES:
patent: 4732838 (1988-03-01), Sechi et al.
patent: 5173392 (1992-12-01), Miersch et al.
patent: 5648125 (1997-07-01), Cane
patent: 5714247 (1998-02-01), Kuo
patent: 5747222 (1998-05-01), Ryu
patent: 5879854 (1999-03-01), Tomita et al.

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