Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2008-04-02
2009-02-17
Nguyen, Thanh (Department: 2893)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S421000, C438S619000, C438S637000, C257SE21476
Reexamination Certificate
active
07491578
ABSTRACT:
The present invention relates to a process for preparing a robust crack-absorbing integrated circuit chip comprising a crack trapping structure containing two metal plates and a via-bar structure sandwiched between said plates.
REFERENCES:
patent: 5665655 (1997-09-01), White
patent: 5789302 (1998-08-01), Mitwalsky et al.
patent: 5834829 (1998-11-01), Dinkel et al.
patent: 6022791 (2000-02-01), Cook et al.
patent: 6025639 (2000-02-01), Mitwalsky et al.
patent: 6084287 (2000-07-01), Mitwalsky et al.
patent: 6271578 (2001-08-01), Mitwalsky et al.
patent: 6365958 (2002-04-01), Ibnabdeljalil et al.
patent: 6383893 (2002-05-01), Begle et al.
patent: 6806168 (2004-10-01), Towle et al.
patent: 6972209 (2005-12-01), Agarwala et al.
patent: 7067902 (2006-06-01), Hichri et al.
patent: 7091621 (2006-08-01), Eppes et al.
patent: 7098676 (2006-08-01), Landers et al.
patent: 7109093 (2006-09-01), Fitzsimmons et al.
patent: 7163883 (2007-01-01), Agarwala et al.
patent: 7223673 (2007-05-01), Wang et al.
patent: 7259043 (2007-08-01), Rolda, Jr. et al.
patent: 7314811 (2008-01-01), Tan et al.
patent: 7335577 (2008-02-01), Daubenspeck et al.
patent: 2002/0024115 (2002-02-01), Ibnabdeljalil et al.
patent: 2004/0129938 (2004-07-01), Landers et al.
patent: 2005/0026397 (2005-02-01), Daubenspeck et al.
patent: 2005/0118803 (2005-06-01), Hichri et al.
patent: 2005/0208781 (2005-09-01), Fitzsimmons et al.
patent: 2006/0012014 (2006-01-01), Chen et al.
patent: 2006/0099775 (2006-05-01), Daubenspeck et al.
patent: 2006/0190846 (2006-08-01), Hichri et al.
patent: 2007/0069336 (2007-03-01), Ning
patent: 2007/0102792 (2007-05-01), Wu
patent: 2007/0108638 (2007-05-01), Lane et al.
patent: 2007/0194409 (2007-08-01), Wang et al.
Bonilla Griselda
Doyle James P
Landis Howard S
Lane Michael W
Liniger Eric G
Aulisio Leander F.
International Business Machines - Corporation
Nguyen Thanh
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