Method of forming contact structure

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156644, 156651, 156653, 156656, 156657, 1566591, 156662, 257301, 257758, 437 52, 437189, 437203, 437245, H01L 21306, B44C 122, C23F 100, C03C 1500

Patent

active

051748584

ABSTRACT:
A method of forming a contact structure comprising a first step whereby a contact hole is formed with an etching stopper film by way of self-alignment, a second step whereby the etching stopper film is removed from the contact hole, and a third step of metallization, whereby unnecessary intermediate film layers are removed from the connected regions.

REFERENCES:
patent: 5059548 (1991-10-01), Kim
T. Kaga et al., Extended Abstracts of 19th SSDM, pp. 15-18, 1987.
Fuse et al., The Proceeding of the 19th Solid Element and Material Conference, p. 11 (Tokyo, Aug. 1987).
Kusters et al., Symp. VLSI Technical Digest, p. 93 (1987).
Auer et al., Extended Abstracts of 22nd Conference on Solid State Devices and Materials, p. 401 (1990).

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