Method of forming conductive paths on a substrate containing dep

Details Method of forming conductive paths on a substrate containing dep Method of forming conductive paths on a substrate containing dep

1995-12-11

1998-07-21

Lesmes, George F.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430313, 430314, G03C 500

Patent

active

057833680

ABSTRACT:
The invention concerns a method of forming a number of electric conductors at a very short distance from the end of depressions such as V-grooves on a substrate. In one configuration example, a film of PTFE or of a similar material is laminated over the entire surface of the substrate. Holes are etched in the film. The holes are metallized. Conductive paths are formed, which are electrically connected to the metallized holes. The film in the area of the grooves is removed by etching. In another configuration example, the grooves are temporarily filled with a photoresist and the conductive paths and contact surfaces are formed in accordance with a photolithographic method.

REFERENCES:
patent: 5105055 (1992-04-01), Mooney et al.
patent: 5268066 (1993-12-01), Tabasky et al.
patent: 5344545 (1994-09-01), Tsukada et al.
patent: 5526454 (1996-06-01), Mayer
Patent Abstracts of Japan, vol. 14, No. 557 (E-1011 (Dec. 11, 1990) and JP-A-02 239638, Sep. 21, 1990 (Toppan Printing Co. Ltd.).
"Einfuhrung in die Leiterplattentechnologie", M. Hummel, Eugen G. Leuze Verlag, Saulgau/Wurtt., 1985, pp. 93-95.
"Optoelektroische Mikrosysteme", G. Benz, Elektronik, vol. 21, 1993, pp. 134, 137, 138, 140-142.

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