Method of forming complex shaped metal-plastic composite lead fr

Details Method of forming complex shaped metal-plastic composite lead fr Method of forming complex shaped metal-plastic composite lead fr

1977-02-25

1978-05-16

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156634, 156656, 156659, 174 52R, B44C 122, C03C 1500, C03C 2506, C23F 102

Patent

active

040897338

ABSTRACT:
A method is disclosed for forming complex shaped, metal-plastic composite lead frame structures for integrated circuit packaging. The lead frame pattern is formed on a metallic substrate having a profiled plastic member bonded thereto at such location as to hold the complexed shaped metal lead portions in a fixed spaced arrangement. The subject method results in substantial economies in reduced usage of plastics material and yet a high grade product having reliably positioned leads.

REFERENCES:
patent: 3539259 (1970-11-01), Hillman et al.
patent: 3611061 (1971-10-01), Segerson
patent: 3676748 (1972-07-01), Kobayashi et al.
patent: 3711625 (1973-01-01), Dupuls
patent: 3763404 (1973-10-01), Aird

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