Method of forming CNT containing wiring material and...

Details Method of forming CNT containing wiring material and... Method of forming CNT containing wiring material and...

2005-03-10

2009-08-25

Nguyen, Nam X (Department: 1795)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S298120, C204S298130, C204S298260, C216S013000

Reexamination Certificate

active

07578909

ABSTRACT:
A method of forming a CNT containing wiring material is conducted by sputtering simultaneously CNT and a metal material on a surface of a substrate to form a CNT containing metal layer, then pattern-etching the CNT containing metal layer to form a wiring pattern. A sputtering target material having a metal material and CNT is used in the method.

REFERENCES:
patent: 3709809 (1973-01-01), Wright
patent: 6455847 (2002-09-01), Yedur et al.
patent: 2002/0179564 (2002-12-01), Geobegan et al.
patent: 2003/0056928 (2003-03-01), Kubota et al.
patent: 2003/0175462 (2003-09-01), Nishino et al.
patent: 2003/0180461 (2003-09-01), Hwang et al.
patent: 2006/0091557 (2006-05-01), Sakamoto et al.
patent: 61-110762 (1986-05-01), None
patent: 02-148733 (1990-06-01), None
patent: 02-263982 (1990-10-01), None
patent: 2004-156074 (2004-06-01), None
patent: WO 01/68936 (2001-09-01), None
patent: WO 2004/040044 (2004-05-01), None
patent: WO 2004/051726 (2004-06-01), None
Japanese Office Action dated Dec. 16, 2008 with English Translation.

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