Semiconductor device manufacturing: process – Direct application of electrical current – To alter conductivity of fuse or antifuse element
Patent
1997-02-21
1998-12-22
Chang, Joni
Semiconductor device manufacturing: process
Direct application of electrical current
To alter conductivity of fuse or antifuse element
438132, 438601, 438460, H01L 21326, H01L 21479
Patent
active
058519033
ABSTRACT:
A method for decreasing the pitch of polysilicon fuses uses tungsten barriers formed adjacent to the fuse elements. The tungsten barriers are made compatible with the process to form a crack stop by stacking tugsten at the via level on top of the tungsten at the contact level in the crack stop. An interlevel dielectric is used as a cover for the fuse.
REFERENCES:
patent: 4413272 (1983-11-01), Mochizuki et al.
patent: 4792835 (1988-12-01), Sacarisen et al.
patent: 5235205 (1993-08-01), Lippitt, III
patent: 5241212 (1993-08-01), Motonami et al.
patent: 5252844 (1993-10-01), Takagi
patent: 5365104 (1994-11-01), Godinho et al.
patent: 5420455 (1995-05-01), Gilmour
patent: 5444012 (1995-08-01), Yoshizumi et al.
patent: 5451810 (1995-09-01), Tigelaar et al.
patent: 5550399 (1996-08-01), Okazaki
patent: 5550404 (1996-08-01), Yen et al.
patent: 5585662 (1996-12-01), Ogawa
patent: 5614440 (1997-03-01), Bezama et al.
patent: 5641703 (1997-06-01), Cohen et al.
Chang Joni
International Business Machine Corporation
Sabo, Esq. William D.
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