Method of forming chip semiconductor devices

Details Method of forming chip semiconductor devices Method of forming chip semiconductor devices

1998-02-09

2000-06-20

Whitehead, Jr., Carl

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having a perfecting coating

438110, 438114, 438458, 438464, H01L 2146

Patent

active

060777575

ABSTRACT:
A method of fabricating a chip semiconductor device includes steps in which electrically conductive bumps are provided on electrodes of semiconductor elements on a wafer, an insulating substrate having an electrode pattern is combined onto the wafer so that the electrode pattern is made into contact with the bumps, only the wafer on which the semiconductor elements are provided is divided by grooves into a plurality of chips each of which has a semiconductor element, a liquid resin is flowed into the grooves and onto the chips for subsequent curing the resin, and the cured resin and the insulating substrate are concurrently cut along the grooves so that a plurality of semiconductor devices are formed.

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