Method of forming ball grid array contacts

Details Method of forming ball grid array contacts Method of forming ball grid array contacts

1997-11-05

1999-09-28

Niebling, John F.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438613, 438615, H01L 2144

Patent

active

059603070

ABSTRACT:
The invention is to a method for forming solder contact balls for a ball grid array semiconductor package by aligning a sheet of solder (18) on a semiconductor package substrate (15) having a plurality of contact areas (16). A heated wire grid (20,21)is applied to the sheet of solder (18) to separate the solder sheet into a plurality of individual solder plates (22), one each for each contact area (16). Heat is then applied to the solder plates (22) and substrate (15) to melt the solder plates (22) and to reflow the melted solder to form a solder ball (23) at each contact area (16).

REFERENCES:
patent: 5393696 (1995-02-01), Koh et al.
patent: 5516032 (1996-05-01), Sakemi et al.

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