Method of forming anisotropic heat spreading apparatus for...

Metal working – Method of mechanical manufacture – Heat exchanger or boiler making

Reexamination Certificate

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C029S422000, C361S709000, C361S710000, C257S720000, C264S642000

Reexamination Certificate

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07464462

ABSTRACT:
A method for forming a heat spreading apparatus for semiconductor devices is disclosed. The method includes extruding a frame material to form multiple individual cells including fillable openings within the frame material; filling a first group of the individual cells with one or more high thermal conductivity materials; filling at least a second group of the individual cells with one or more materials of lower thermal conductivity than in the first group of the individual cells; and implementing a reflowing process following filling the multiple individual cells so as to infiltrate the materials within the individual cells, wherein defined walls of the frame material remain following the reflowing.

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