Semiconductor device manufacturing: process – Having organic semiconductive component
Reexamination Certificate
2006-01-20
2009-08-11
Nguyen, Ha Tran T (Department: 2829)
Semiconductor device manufacturing: process
Having organic semiconductive component
C438S082000, C438S759000, C438S780000, C257S040000, C257S642000, C257S643000, C156S442000, C156S528000, C216S036000
Reexamination Certificate
active
07572667
ABSTRACT:
A method of forming an organic semiconductor pattern is provided. A pattern is formed on a first substrate. An adhesive is coated on the pattern to form an adhesive pattern. An organic semiconductor layer is formed on a second substrate. The second substrate is combined with the first substrate to remove a portion of the organic semiconductor layer attached to the pattern from the second substrate to form the organic semiconductor pattern.
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patent: 6838776 (2005-01-01), Leal et al.
patent: 6966997 (2005-11-01), Inganas et al.
patent: 2002/0094594 (2002-07-01), Kim et al.
Kim Bo-Sung
Lee Yong-Uk
Ryu Min-Seong
Haynes and Boone, LLP.
Nguyen Ha Tran T
Samsung Electronics Co,. Ltd.
Whalen Daniel
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