Method of forming an organic semiconductor pattern and...

Semiconductor device manufacturing: process – Having organic semiconductive component

Reexamination Certificate

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C438S082000, C438S759000, C438S780000, C257S040000, C257S642000, C257S643000, C156S442000, C156S528000, C216S036000

Reexamination Certificate

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07572667

ABSTRACT:
A method of forming an organic semiconductor pattern is provided. A pattern is formed on a first substrate. An adhesive is coated on the pattern to form an adhesive pattern. An organic semiconductor layer is formed on a second substrate. The second substrate is combined with the first substrate to remove a portion of the organic semiconductor layer attached to the pattern from the second substrate to form the organic semiconductor pattern.

REFERENCES:
patent: 6344660 (2002-02-01), Dimitrakopoulos et al.
patent: 6838776 (2005-01-01), Leal et al.
patent: 6966997 (2005-11-01), Inganas et al.
patent: 2002/0094594 (2002-07-01), Kim et al.

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