Method of forming an organic polymer insulating film in a semico

Details Method of forming an organic polymer insulating film in a semico Method of forming an organic polymer insulating film in a semico

1998-06-22

2000-11-21

Nelms, David

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

438 80, 437100, 437430, H01L 2131

Patent

active

061502847

ABSTRACT:
A method of forming an organic polymer insulator in a semiconductor device comprises the step of causing a thermal polymerization of at least one kind of monomers and oligomers supplied in vapor phase.

REFERENCES:
patent: 5079221 (1992-01-01), Morohashi
patent: 5284779 (1994-02-01), Miyanaga
patent: 5415889 (1995-05-01), Nakayama et al.
J. Wary et al., "Vacuum-Deposited Parylene AF-4 : A Thermally Stable, Low Dielectric Constant Polymer For Interlayer Dielectric Use", pp. 207-213, DUMIC Conference, Feb. 20-21, 1996.
M.R. Schneider, "A Multilayer Interconnect Process for VLSI GaAs ICs Employing Polyimide Interlayer Dielectrics", pp. 93-99, VMIC Conference, Jun. 9-10, 1992.

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