Method of forming an electrostatic discharge protection circuit

Details Method of forming an electrostatic discharge protection circuit Method of forming an electrostatic discharge protection circuit

1992-09-21

1994-03-01

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 59, 437 60, 437913, 148DIG11, H01L 2170

Patent

active

052907244

ABSTRACT:
An integrated circuit has a semiconductor die with a substrate and at least first and second bond pads. An internal circuit is fabricated on the semiconductor die and connected to the first bond pad. An electrostatic discharge protection circuit including cascaded bipolar transistors is connected in series with a field effect transistor between the first and second bond pads. In another version, an output buffer of the integrated circuit is divided into sections. An electrostatic discharge protection circuit is triggerable in response to a voltage in the substrate. Resistive connections are provided from the sections of the output buffer to one of the bond pads. The output buffer is operative upon an electrostatic discharge event to inject sufficient charge into the substrate to produce the voltage to trigger the electrostatic discharge protection circuit. Other circuits, devices, systems and methods are also disclosed.

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