Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-10-31
2006-10-31
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257S750000
Reexamination Certificate
active
07129166
ABSTRACT:
A method of forming an electronic circuit component using the technique of drop on demand printing to deposit droplets of deposition material, said method comprising depositing a plurality of droplets on a surface to form a patterned electronic device comprising multiple discrete portions.
REFERENCES:
patent: 3795443 (1974-03-01), Heine-Geldern et al.
patent: 4104645 (1978-08-01), Fischbeck
patent: 4268597 (1981-05-01), Klavan et al.
patent: 4291316 (1981-09-01), Kakeno et al.
patent: 4523199 (1985-06-01), Ott
patent: 4751530 (1988-06-01), Elrod et al.
patent: 4815199 (1989-03-01), Jenner et al.
patent: 5059266 (1991-10-01), Yamane et al.
patent: 5132248 (1992-07-01), Drummond et al.
patent: 5149548 (1992-09-01), Yamane et al.
patent: 5182571 (1993-01-01), Creagh et al.
patent: 5250439 (1993-10-01), Musho et al.
patent: 5279678 (1994-01-01), Jordan et al.
patent: 5328520 (1994-07-01), Itagaki
patent: 5376503 (1994-12-01), Audett et al.
patent: 5424822 (1995-06-01), Daniels
patent: 5459174 (1995-10-01), Merrill et al.
patent: 5502307 (1996-03-01), Baliga et al.
patent: 5502585 (1996-03-01), Qian
patent: 5510066 (1996-04-01), Fink et al.
patent: 5512122 (1996-04-01), Sokyrka
patent: 5539100 (1996-07-01), Wasielewski et al.
patent: 5560543 (1996-10-01), Smith et al.
patent: 5595689 (1997-01-01), Kulkarni et al.
patent: 5598200 (1997-01-01), Gore
patent: 5609919 (1997-03-01), Yuan et al.
patent: 5627578 (1997-05-01), Weintraub
patent: 5637426 (1997-06-01), Uchikawa
patent: 5639386 (1997-06-01), Burke et al.
patent: 5649480 (1997-07-01), Yim
patent: 5685491 (1997-11-01), Marks et al.
patent: 5705826 (1998-01-01), Aratani et al.
patent: 5740287 (1998-04-01), Scalora et al.
patent: 5810988 (1998-09-01), Smith, Jr. et al.
patent: 5902537 (1999-05-01), Almquist et al.
patent: 5930117 (1999-07-01), Gengel
patent: 5958169 (1999-09-01), Titterington et al.
patent: 6023464 (2000-02-01), Woundy
patent: 6049826 (2000-04-01), Beser
patent: 6053596 (2000-04-01), Nakano et al.
patent: 6059393 (2000-05-01), Takahashi
patent: 6087196 (2000-07-01), Sturm et al.
patent: 6094676 (2000-07-01), Gray et al.
patent: 6100954 (2000-08-01), Kim et al.
patent: 6120588 (2000-09-01), Jacobson
patent: 6153001 (2000-11-01), Suzuki et al.
patent: 6164850 (2000-12-01), Speakman
patent: 6402403 (2002-06-01), Speakman
patent: 6503831 (2003-01-01), Speakman
patent: 6596224 (2003-07-01), Sachs et al.
patent: 6599582 (2003-07-01), Kiguchi et al.
patent: 6849308 (2005-02-01), Speakman et al.
patent: 2002/0164432 (2002-11-01), Hofmeister
patent: 2116875 (1995-02-01), None
patent: 3126372 (1982-09-01), None
patent: 3728337 (1989-03-01), None
patent: 3740149 (1989-06-01), None
patent: 19654828 (1996-12-01), None
patent: 19654828 (1996-12-01), None
patent: 0484808 (1991-10-01), None
patent: 0683405 (1995-05-01), None
patent: 0683405 (1995-05-01), None
patent: 0761440 (1996-09-01), None
patent: 0761440 (1996-09-01), None
patent: 0736580 (1996-10-01), None
patent: 0855614 (1998-07-01), None
patent: 0880303 (1998-11-01), None
patent: 2717420 (1995-09-01), None
patent: 1566113 (1980-04-01), None
patent: 2183500 (1987-06-01), None
patent: 2183500 (1987-06-01), None
patent: 2196650 (1988-05-01), None
patent: 2202636 (1988-09-01), None
patent: 2304812 (1997-03-01), None
patent: 03057625 (1991-03-01), None
patent: 04099646 (1992-03-01), None
patent: 818125 (1996-01-01), None
patent: 08005828 (1996-01-01), None
patent: 08018125 (1996-01-01), None
patent: 080240803 (1996-09-01), None
patent: 090219019 (1997-08-01), None
patent: WO 89/05567 (1989-06-01), None
patent: WO 95/05943 (1995-03-01), None
patent: WO 95/23244 (1995-08-01), None
patent: WO 97/48557 (1997-12-01), None
patent: WO 99/19900 (1999-04-01), None
patent: WO 99/60829 (1999-11-01), None
patent: WO 01/14988 (2001-03-01), None
Hebner, T.R. , et al. Ink-jet Printing of Doped Polymers for Organic Light Emitting Devices, American Institute of Physics, vol. 72, No. 5, Feb. 2, 1998, pp. 519-521.
British Search Report for priority document GB 9721808.5—Sep. 16, 1998.
British Search Report for priority document GB 9721809.3—Jul. 14, 1998.
International Search Report for WO 99/19900.
XP-002092497, Garnier et al, abstract only, Science, Sep. 16, 1994.
British Search Report for GB 0220653.0—Oct. 11, 2002.
British Search Report for GB 0220651.4—Oct. 4, 2002.
British Search Report for GB 0220654.8—Oct. 11, 2002.
British Search Report for GB 0201275.5—Mar. 7, 2002.
Garnier, F. et al, “All-polymer field effect transistor realized by printing techniques”, Science, vol. 265, No. 5179, Sep. 16, 1994, pp. 1684-1686.
British Search Report for priority document GB 97218085 (1998).
British Search Report for priority document GB 97218093 (1998).
Hebner, T.R., et al., “Ink-jet Printing of Doped Polymers for Organic Light Emitting Devices,”American Institute of Physics, vol. 72, No. 5, pp. 519-521 (1998).
IBM Tech Disclosure Bulletin, Braille Printed Dot Configuration, pp. 1204 Aug. (1997).
International Search Report for WO 99/19900.
International Search Report from GB9912437.2 and GB 0005929.5.
Lerner, et al., “Electromagnetic Radiation,”Encyclopedia of Physics, pp. 285-288 (1991).
Notice of Opposition in EP Patent 1163552, Appl. No.: 00935358.2 (Aug. 2003).
Translation of DE 4228 344A 1 by Dr. Herbert Feld, et al. (1994).
Translation of DE 4228 344A 1 to Feld, et al. (1995).
Translation of DE 4329 338A 1 to Nishikawa (1995).
XP-002092497 Garnier, et al., Abstract only Science Sep. 16, 1994.
Lee Calvin
Nelms David
Patterning Technologies Limited
Wolf Greenfield & Sacks P.C.
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