Method of forming an electrically conductive polymer bump over a

Details Method of forming an electrically conductive polymer bump over a Method of forming an electrically conductive polymer bump over a

1995-07-24

1997-10-07

Quach, T. N.

Fishing, trapping, and vermin destroying

437194, 437197, 437228, H01L 21283

Patent

active

056747802

ABSTRACT:
A method of forming an electrically conductive polymer bump (22) over an aluminum electrode (21) produces low contact resistance for an interconnect structure (24). Aluminum oxide is first removed from the aluminum electrode (21). Tiron and palladium are subsequently bonded to the fresh surface of the aluminum electrode (21). Finally, the electrically conductive polymer bump (22) is formed over the aluminum electrode (21). The Tiron and palladium improve the electrical contact between the conductive polymer bump (22) and the aluminum electrode (21) thereby reducing the contact resistance. The Tiron also inhibits corrosion of the aluminum electrode (21) and enhances the conductivity by catalytically shrinking the cyanate ester conductive bump.

REFERENCES:
patent: 5055356 (1991-10-01), Minowa et al.
patent: 5074947 (1991-12-01), Estes et al.
patent: 5130052 (1992-07-01), Kreh et al.
patent: 5196371 (1993-03-01), Kulesza et al.
patent: 5565378 (1996-10-01), Harada et al.
patent: 5583073 (1996-12-01), Lin et al.

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