Method of forming an electrical interconnect

Details Method of forming an electrical interconnect Method of forming an electrical interconnect

1995-04-03

1996-12-24

Picardat, Kevin

Fishing, trapping, and vermin destroying

437183, 437189, 437203, H01L 2160

Patent

active

055873421

ABSTRACT:
Interconnect bumps are formed on a circuit substrate using printing or dispensing techniques with a wet photoresist layer as a mask. A conductive paste is disposed in openings of a wet photoresist layer. The conductive paste is at least partially cured before the wet photoresist layer is removed. Alternatively, the wet photoresist layer may remain if it is a photo-imagable polyimide.

REFERENCES:
patent: 4806706 (1989-02-01), Machida et al.
patent: 5093279 (1992-03-01), Andreshak et al.
patent: 5100501 (1992-03-01), Blumenthal et al.
patent: 5149671 (1992-09-01), Koh et al.
patent: 5169800 (1992-12-01), Kobayashi
patent: 5246880 (1993-09-01), Reele et al.
patent: 5266446 (1993-11-01), Chang et al.
patent: 5280414 (1994-01-01), Davis et al.
patent: 5376229 (1994-12-01), Miller et al.
patent: 5409862 (1995-04-01), Wada et al.
patent: 5411918 (1995-05-01), Keible et al.
patent: 5446247 (1995-08-01), Cergel et al.

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