Method of forming an array of apertures in an aluminum foil

Details Method of forming an array of apertures in an aluminum foil Method of forming an array of apertures in an aluminum foil

1989-05-08

1990-09-18

Hoch, Ramon

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156645, B44C 0122

Patent

active

049576011

ABSTRACT:
The disclosures relates to a method of forming an array of small apertures in an aluminum foil for receiving semiconductor spheres in said aperature. The apertures are formed by embossing the foil at the locations of the apertures to provide worked metal regions of reduced thickness at said locations. The foil is then etched in toto, etching taking place more rapidly at the worked metal region. Also, due to the reduced thickness of the foil at the embossed regions, such regions are etched away to provide apertures before the remainder of the foil undergoes material metal loss to provide the desired aperture array.

REFERENCES:
patent: 2554256 (1951-05-01), Lewis et al.
patent: 3035990 (1962-05-01), Davis et al.
patent: 3505180 (1970-04-01), Brogden
patent: 3773576 (1973-11-01), Pond
patent: 3813310 (1974-05-01), Droege et al.
patent: 3923566 (1975-12-01), Law

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