Method of forming a titanium film and a barrier metal film on a

Details Method of forming a titanium film and a barrier metal film on a Method of forming a titanium film and a barrier metal film on a

1997-09-30

2000-04-18

Meeks, Timothy

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

427576, 427253, 42725526, 4272554, 4272557, 438627, 438643, 438648, 438653, 438656, C23C 1634

Patent

active

060512814

ABSTRACT:
A method of forming a titanium film and a titanium nitride film on a substrate by lamination which method is capable of suppressing contamination of the substrate due to the by-product and of reducing a contact resistance value of the titanium film. By carrying out the step of forming a titanium film on a surface of a substrate, the step of subjecting the substrate to the plasma processing in an atmosphere of the mixed gas of nitrogen gas and hydrogen gas, thereby nitriding a surface layer of the titanium film to form thereon a nitride layer, and the step of forming a barrier film (e.g., a titanium nitride film) on the titanium film having the nitride layer formed thereon, both the titanium film and the titanium nitride film are formed on the substrate by lamination.

REFERENCES:
patent: 5173327 (1992-12-01), Sandhu et al.
patent: 5279857 (1994-01-01), Eichman et al.
patent: 5308655 (1994-05-01), Eichman et al.
patent: 5593511 (1997-01-01), Foster et al.
Matsumoto et al., Journal of the Less Common Metals, vol. 84, pp. 157-163, Mar. 1982.

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