Method of forming a thin wafer stack for a wafer level package

Details Method of forming a thin wafer stack for a wafer level package Method of forming a thin wafer stack for a wafer level package

2005-06-02

2009-02-24

Nguyen, Khiem D. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S455000, C438S459000, C257SE21122

Reexamination Certificate

active

07494845

ABSTRACT:
A method of forming a stack of thin wafers provides a wafer level stack to greatly reduce process time compared to a method where individually separated chips are stacked after a wafer is sawed. A rigid planar wafer support member stabilizes and planarizes each wafer while it is thin or its thickness is reduced and during subsequent wafer processing. Thinned wafers are stacked and the external support members are removed by applying heat or ultraviolet (UV) light to an expandable adhesive layer between the support members and the thin wafers. The stacked wafers then can be further processed and packaged without thin-wafer warping, cracking or breaking. A wafer level package made in accordance with the invented method also is disclosed.

REFERENCES:
patent: 5432999 (1995-07-01), Capps et al.
patent: 5618752 (1997-04-01), Gaul
patent: 6642081 (2003-11-01), Patti
patent: 2003-124147 (2003-04-01), None
patent: 2001-0054575 (2001-07-01), None
patent: 2002-0024624 (2002-04-01), None
English language abstract of the Korean Publication No. 2001-0054575.
English language abstract of the Korean Publication No. 2002-0024624.
English language abstract of the Japanese Publication No. 2003-124147.

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