Method of forming a thin film pattern with a trapezoidal cross s

Details Method of forming a thin film pattern with a trapezoidal cross s Method of forming a thin film pattern with a trapezoidal cross s

1991-05-13

1992-07-07

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156657, 1566591, 156662, 430313, H01L 21306, B44C 122

Patent

active

051279894

ABSTRACT:
The present invention provides a method of forming a thin film pattern with a trapezoidal cross section. In this method, a resist pattern with an inverted-trapezoidal cross section is formed on a thin film. Using the resist pattern with the inverted-trapezoidal cross section as a mask, the thin film is dry-etched. A resist pattern is left with the resist pattern used as a mask. The resist pattern has a trapezoidal cross section.

REFERENCES:
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patent: 4764245 (1988-08-01), Grewal
patent: 5007982 (1991-04-01), Tsou
patent: 5007984 (1991-04-01), Tsutsumi et al.
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Extended Abstracts, vol. 87, No. 2, 1987, pp. 676-677; "Photolithography for Dry Metal Etch", Holland et al.
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IBM Technical Disclosure Bulletin, vol. 28, No. 11, Apr. 1986, pp. 4805-4806; "Dyed Resist to Enhance Undercut Angles Attainable on Reduction Projection Printers".
Journal of the Electrochemical Society, vol. 135, No. 2, Feb. 1988, pp. 471-476; "Contrast Enhancing Additives for Positive Photoresist", Pampalone et al.

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