Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...
Reexamination Certificate
2000-03-20
2001-08-07
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
C438S758000, C430S127000
Reexamination Certificate
active
06271149
ABSTRACT:
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is based upon and claims the benefit of priority from the prior Japanese Patent Applications No. 11-139820, filed May 20, 1999; No. 11-228521, filed Aug. 12, 1999; and No. 11-280266, filed Sep. 30, 1999, the entire contents of which are incorporated herein by reference.
BACKGROUND OF THE INVENTION
The present invention relates to a method and apparatus for manufacturing a semiconductor device made by forming a thin film on a substrate, such as a thin-film photovoltaic module.
To manufacture a thin-film photovoltaic module, for example, a thin film such as a semiconductor film or a metal film is formed on a substrate made of glass and having a transparent electrode formed on it.
When the thin film is formed on the substrate, particles may be attached to the substrate. If this happens, defects will develop. Therefore, the substrate is usually washed before the thin film is formed on the substrate in order to remove the particles.
When the washed substrate is left to stand and is thereby dried, the washing liquid attached to the substrate may form a water mark (stain). The substrate is therefore forcibly dried after the washing.
To dry the washed substrate, a clean oven is used in a conventional method. The clean oven is designed such that clean air is introduced into the interior. In the clean oven, the air is heated by a heater and circulated.
Therefore, if the washed substrate is placed in the clean oven, it can be dried with the heated air circulating in the clean oven.
As indicated above, the clean oven is designed to dry the substrate while the heated air is circulated, oven is clean, hence, the air gradually contain with particles remaining in the clean oven even if it is clean when introduced into the clean oven.
It is therefore easy for particles to attach to the substrate dried in the clean oven. Consequently, defects are likely to develop in the thin film formed on the substrate.
BRIEF SUMMARY OF THE INVENTION
An object of the present invention is to provide a method and apparatus for manufacturing a semiconductor device, characterized in that a washed substrate is free of contamination while it is being dried.
To achieve the object, a method of manufacturing a semiconductor device, wherein a thin film is formed on a substrate, comprises the steps of:
(a) washing the substrate with a washing liquid;
(b) removing the washing liquid from the substrate by blowing a compressed air to the substrate washed; and
(c) forming a thin film on the substrate immediately after the step (b), without performing to another step.
In the method, the substrate is dried with clean air by blowing compressed air to the substrate. Contamination of the substrate can be prevented in the drying process.
Other objects and advantages of the present invention will become apparent from a consideration of the following Detailed Description of the Invention. The objects and advantages of the present invention can be attained by the constitutions clearly set forth in the accompanying claims or combination of the constitutions.
REFERENCES:
patent: 5501744 (1996-03-01), Albright et al.
patent: 5587226 (1996-12-01), Leung et al.
patent: 6103442 (2000-08-01), Katagiri et al.
patent: 10-209477 (1998-08-01), None
Hayashi Katsuhiko
Kondo Masataka
Kuribe Eiji
Hogan & Hartson LLP
Kaneka Corporation
Le Dung
Nelms David
LandOfFree
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