Method of forming a surface micromachined MEMS device

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE21001

Reexamination Certificate

active

07906359

ABSTRACT:
A method of forming a surface micromachined MEMS device applies an insulator to a substrate, and then deposits a conductive path on the insulator. The conductive path is capable of transmitting an electronic signal between two points on the MEMS device. The insulator electrically isolates the conductive path from the substrate. The MEMS device illustratively is free of semiconductor junctions formed by the substrate and the conductive path.

REFERENCES:
patent: 5216490 (1993-06-01), Greiff et al.
patent: 5326726 (1994-07-01), Tsang et al.
patent: 5343064 (1994-08-01), Spangler et al.
patent: 5399415 (1995-03-01), Chen et al.
patent: 5578224 (1996-11-01), Core
patent: 5639542 (1997-06-01), Howe et al.
patent: 5640039 (1997-06-01), Chau et al.
patent: 5798283 (1998-08-01), Montague et al.
patent: 5828115 (1998-10-01), Core
patent: 5858809 (1999-01-01), Chau et al.
patent: 5879963 (1999-03-01), Howe et al.
patent: 5919548 (1999-07-01), Barron et al.
patent: 5939633 (1999-08-01), Judy
patent: 6021675 (2000-02-01), Seefeldt et al.
patent: 6160314 (2000-12-01), Lee et al.
patent: 6500763 (2002-12-01), Kim et al.
patent: 6505511 (2003-01-01), Geen et al.
patent: 2002/0117728 (2002-08-01), Brosnihhan et al.
patent: 2004/0152272 (2004-08-01), Fladre et al.
patent: 198 47 455 (2000-04-01), None
patent: 0 834 759 (1998-08-01), None
patent: WO 02/12116 (2002-02-01), None
The International Search Report, International Searching Authority, Sep. 23, 2004, 6 pages.
Timothy J. Brosnihan et al., Embedded Interconnect and Electrical Isolation for High-Aspect-Ration, SIO Inertial Instruments; Jun. 16-19, 1997; pp. 637-640.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming a surface micromachined MEMS device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming a surface micromachined MEMS device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a surface micromachined MEMS device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2777948

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.