Method of forming a silicon gate to produce silicon devices with

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438595, 438197, H01L 2128

Patent

active

059813644

ABSTRACT:
Disclosed herein is a method of forming a silicon gate stack onto a silicon substrate for a silicon device. The method of forming the silicon gate stack comprises the steps of growing an oxide layer onto the silicon substrate, depositing a thin layer of silicon to form a thin layer of silicon over the oxide layer, depositing a thick layer of silicon over the thin layer of silicon, and introducing impurities into only the thick layer of silicon to form a silicon gate whereby the silicon gate includes the thin layer of silicon and the thick layer of silicon having the impurities. The impurities being introduced with a concentration, the impurities concentration and the thick layer thickness impeding an encroachment by the oxide layer into the silicon gate during application of a protective screen oxide layer around the silicon gate stack.

REFERENCES:
patent: 4249968 (1981-02-01), Gardiner et al.
patent: 4558338 (1985-12-01), Sakata
patent: 4584760 (1986-04-01), Okazawa
patent: 4914046 (1990-04-01), Tobin et al.
patent: 5147820 (1992-09-01), Chittipeddi et al.
patent: 5256894 (1993-10-01), Shino
patent: 5350698 (1994-09-01), Huang et al.
patent: 5438007 (1995-08-01), Vinal et al.
patent: 5441904 (1995-08-01), Kim et al.
patent: 5444302 (1995-08-01), Nakajima et al.
patent: 5464789 (1995-11-01), Saito
patent: 5512502 (1996-04-01), Ootsuka et al.
patent: 5567638 (1996-10-01), Lin et al.
patent: 5614428 (1997-03-01), Kapoor
patent: 5641708 (1997-06-01), Sardella et al.
patent: 5652156 (1997-07-01), Liao et al.
patent: 5712181 (1998-01-01), Byun et al.
patent: 5767004 (1998-06-01), Balasubramanian et al.
patent: 5877074 (1999-03-01), Jeng et al.
patent: 5879975 (1999-03-01), Karlsson et al.
patent: 5882994 (1999-03-01), Araki et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming a silicon gate to produce silicon devices with does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming a silicon gate to produce silicon devices with, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a silicon gate to produce silicon devices with will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1455244

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.