Method of forming a semiconductor laser chip having a marker

Details Method of forming a semiconductor laser chip having a marker Method of forming a semiconductor laser chip having a marker

2007-06-05

2007-06-05

Hoang, Quoc (Department: 2818)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C257S797000, C257SE23179

Reexamination Certificate

active

11210842

ABSTRACT:
A method of manufacturing a semiconductor laser chip has following steps. First, a semiconductor substrate including an active layer and a block layer is provided. An electrode line pattern and a marker are formed on the semiconductor substrate. The semiconductor substrate is etched to form a W channel. Then, an oxide layer is formed on the semiconductor substrate to cover the electrode line pattern and the marker. A part of the oxide layer to form an electrode contact that exposes the electrode line pattern. A mounting electrode is formed on the electrode line pattern. Finally, the semiconductor substrate is divided into a plurality of semiconductor laser chip.

REFERENCES:
patent: 5284792 (1994-02-01), Forster et al.
patent: 6853042 (2005-02-01), Yoshida et al.
“Synonymous With Alignment-Optical Packaging”, Journal of Japan Institute of Electronics Packaging, vol. 13, No. 1 (1988), pp. 54-56.

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