Method of forming a semiconductor device using a self-aligned co

Fishing – trapping – and vermin destroying

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437 60, 437919, H01L 2170, H01L 2700

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active

056396821

ABSTRACT:
A semiconductor device using a self-aligned contact and a method for manufacturing the same is disclosed. A gate electrode having a first spacer formed on the sidewalls thereof is formed on a semiconductor substrate. Active regions which are spaced apart from each other by the gate electrode are formed in the semiconductor substrate. A bitline having a second spacer formed on the sidewalls thereof is formed on the gate electrode and the active regions. A self-aligned contact is formed on the active regions and a first pad electrode connected with the active region through the contact is formed between the bitlines. A bitline contact is formed on the bitline, and second and third pad electrodes, which are respectively connected with the bitline and the first pad electrode through the bitline contact, are formed on the bitline. Thus, the alignment tolerances of the bitline contact and the storage-node contact are maximized, so that a reliable semiconductor device can be realized.

REFERENCES:
patent: 5236859 (1993-08-01), Bae et al.
patent: 5284787 (1994-02-01), Ahn
patent: 5386382 (1995-01-01), Ahn

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