Method of forming a semiconductor device

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

Reexamination Certificate

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C438S054000, C438S059000, C257S190000, C257S410000

Reexamination Certificate

active

08048791

ABSTRACT:
Methods for forming a semiconductor device comprising a semiconductor substrate are provided. In accordance with an exemplary embodiment, a method comprises forming a channel layer overlying the semiconductor substrate, forming a channel capping layer having a first surface overlying the channel layer, oxidizing the first surface of the channel capping layer, and depositing a high-k dielectric layer overlying the channel capping layer.

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Gusev, E.P., et al. “Advanced High-k Dielectric Stacks with PolySi and Metal Gates: Recent Progress and Current Challenges,” IBM Journal of Research and Development, Advanced Silicon Technology, Aug. 6, 2006, pp. 387-410, vol. 50, No. 4/5. http://www.research.ibm.com/journal/rd/504/gusev.html.

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