Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region
Reexamination Certificate
2006-06-20
2006-06-20
Geyer, Scott (Department: 2812)
Semiconductor device manufacturing: process
Introduction of conductivity modifying dopant into...
Ion implantation of dopant into semiconductor region
C438S531000, C438S533000
Reexamination Certificate
active
07064048
ABSTRACT:
A semiconductor substrate is provided, and at least one first mask is formed above the semiconductor substrate. The first mask blocks at least one semi-insulating region. A second mask is thereafter formed on a surface of the semiconductor substrate. The second mask covers the semi-insulating region. The semi-insulating region is implanted with a high energy beam of particles by utilizing the second mask and the first mask as particle hindering masks. Finally, the second mask is removed.
REFERENCES:
patent: 6313905 (2001-11-01), Brugger et al.
patent: 6624030 (2003-09-01), Chang et al.
patent: 2004/0051148 (2004-03-01), Johnson et al.
Lai Joey
Lur Water
Geyer Scott
Hsu Winston
United Microelectronics Corp.
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