Method of forming a resin laying in a surface laminated circuit

Details Method of forming a resin laying in a surface laminated circuit Method of forming a resin laying in a surface laminated circuit

1995-10-11

1998-06-16

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Processing feature prior to imaging

430311, 430330, 427 96, 427444, G03F 716

Patent

active

057668256

ABSTRACT:
A method of forming a surface laminated circuit printed circuit board (SLC) where a photosensitive thermosetting resin in solution is applied atop a circuitized substrate. The method starts with the step of concentrating and solidifying the photosensitive thermosetting resin to build up a hardness therein high enough to withstand abrasion. This is done by first dissolving the photosensitive thermosetting resin in a solvent and then applying the solution to a substantially uneven surface. This is followed by evaporating solvent at a temperature below the curing temperature of the photosensitive thermosetting resin. Next, the surface of said resin layer is abraded to form a substantially even surface, and the resin layer is cured by heating the resin high enough to cross link and polymerize the resin.

REFERENCES:
patent: 4938994 (1990-07-01), Choinski
patent: 5265378 (1993-11-01), Rostoker
patent: 5342739 (1994-08-01), Katou et al.
patent: 5516729 (1996-05-01), Dawson

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