Method of forming a recessed structure employing a reverse...

Details Method of forming a recessed structure employing a reverse... Method of forming a recessed structure employing a reverse...

2007-03-06

2007-03-06

Lee, Calvin (Department: 2818)

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

C216S041000

Reexamination Certificate

active

10946570

ABSTRACT:
The present invention provides a method of forming recesses on a substrate, the method including forming on the substrate a patterning layer having first features; trim etching the first features to define trimmed features having a shape; and transferring an inverse of the shape into the substrate.

REFERENCES:
patent: 4267212 (1981-05-01), Sakawaki
patent: 4426247 (1984-01-01), Tamamura et al.
patent: 4507331 (1985-03-01), Hiraoka
patent: 4512848 (1985-04-01), Deckman et al.
patent: 4657845 (1987-04-01), Frchet et al.
patent: 4692205 (1987-09-01), Sachdev et al.
patent: 4731155 (1988-03-01), Napoli et al.
patent: 4891303 (1990-01-01), Garza et al.
patent: 4931351 (1990-06-01), McColgin et al.
patent: 4959252 (1990-09-01), Bonnebat et al.
patent: 4976818 (1990-12-01), Hashimoto et al.
patent: 5028366 (1991-07-01), Harakal et al.
patent: 5071694 (1991-12-01), Uekita et al.
patent: 5110514 (1992-05-01), Soane
patent: 5173393 (1992-12-01), Sezi et al.
patent: 5198326 (1993-03-01), Hashimoto et al.
patent: 5234793 (1993-08-01), Sebald et al.
patent: 5240550 (1993-08-01), Boehnke et al.
patent: 5259926 (1993-11-01), Kuwabara et al.
patent: 5314772 (1994-05-01), Kozicki et al.
patent: 5348616 (1994-09-01), Hartman et al.
patent: 5425848 (1995-06-01), Haisma et al.
patent: 5434107 (1995-07-01), Paranjpe
patent: 5480047 (1996-01-01), Tanigawa et al.
patent: 5512131 (1996-04-01), Kumar et al.
patent: 5545367 (1996-08-01), Bae et al.
patent: 5597438 (1997-01-01), Grewel et al.
patent: 5601641 (1997-02-01), Stephens
patent: 5669303 (1997-09-01), Maracas et al.
patent: 5700626 (1997-12-01), Lee et al.
patent: 5743998 (1998-04-01), Park
patent: 5772905 (1998-06-01), Chou
patent: 5776748 (1998-07-01), Singhvi et al.
patent: 5820769 (1998-10-01), Chou
patent: 5849209 (1998-12-01), Kindt-Larsen et al.
patent: 5849222 (1998-12-01), Jen et al.
patent: 5888650 (1999-03-01), Calhoun et al.
patent: 5905104 (1999-05-01), Eklund et al.
patent: 5907782 (1999-05-01), Wu
patent: 5948470 (1999-09-01), Harrison et al.
patent: 5956216 (1999-09-01), Chou
patent: 5962191 (1999-10-01), Nozaki et al.
patent: 6033977 (2000-03-01), Gutsche et al.
patent: 6046056 (2000-04-01), Parce et al.
patent: 6071372 (2000-06-01), Ye et al.
patent: 6074827 (2000-06-01), Nelson et al.
patent: 6096655 (2000-08-01), Lee et al.
patent: 6150190 (2000-11-01), Stankus et al.
patent: 6218316 (2001-04-01), Marsh
patent: 6232175 (2001-05-01), Liu et al.
patent: 6245581 (2001-06-01), Bonser et al.
patent: 6309580 (2001-10-01), Chou
patent: 6326627 (2001-12-01), Putvinski et al.
patent: 6329256 (2001-12-01), Ibok
patent: 6334960 (2002-01-01), Willson et al.
patent: 6342097 (2002-01-01), Terry et al.
patent: 6355198 (2002-03-01), Kim et al.
patent: 6387787 (2002-05-01), Mancini et al.
patent: 6391217 (2002-05-01), Schaffer et al.
patent: 6426288 (2002-07-01), Meikle
patent: 6455411 (2002-09-01), Jiang et al.
patent: 6468853 (2002-10-01), Balasubramanian et al.
patent: 6468896 (2002-10-01), Rohr et al.
patent: 6482742 (2002-11-01), Chou
patent: 6495430 (2002-12-01), Tsai et al.
patent: 6517995 (2003-02-01), Jacobenson et al.
patent: 6518189 (2003-02-01), Chou
patent: 6541360 (2003-04-01), Plat et al.
patent: 6566258 (2003-05-01), Dixit et al.
patent: 6580172 (2003-06-01), Mancini et al.
patent: 6646662 (2003-11-01), Nebashi et al.
patent: 6686271 (2004-02-01), Raaijmakers et al.
patent: 6696220 (2004-02-01), Bailey et al.
patent: 6703190 (2004-03-01), Elian et al.
patent: 6713238 (2004-03-01), Chou et al.
patent: 6716767 (2004-04-01), Shih et al.
patent: 6719915 (2004-04-01), Willson et al.
patent: 6730256 (2004-05-01), Bloomstein et al.
patent: 6737202 (2004-05-01), Gehoski et al.
patent: 6743713 (2004-06-01), Mukher-Hee-Roy et al.
patent: 6759325 (2004-07-01), Raaijmakers et al.
patent: 6767983 (2004-07-01), Fujiyama et al.
patent: 6770852 (2004-08-01), Stegner
patent: 6776094 (2004-08-01), Whitesides et al.
patent: 6777170 (2004-08-01), Bloomstein et al.
patent: 6809356 (2004-10-01), Chou
patent: 6814879 (2004-11-01), Shibata
patent: 6820677 (2004-11-01), Grinberg et al.
patent: 6828244 (2004-12-01), Chou
patent: 6849558 (2005-02-01), Schaper
patent: 6900881 (2005-05-01), Sreenivasan et al.
patent: 6908861 (2005-06-01), Sreenivasan et al.
patent: 6916584 (2005-07-01), Sreenivasan et al.
patent: 6932934 (2005-08-01), Choi et al.
patent: 2002/0042027 (2002-04-01), Chou et al.
patent: 2002/0132482 (2002-09-01), Chou
patent: 2002/0167117 (2002-11-01), Chou
patent: 2002/0177319 (2002-11-01), Chou
patent: 2003/0034329 (2003-02-01), Chou
patent: 2003/0062334 (2003-04-01), Lee et al.
patent: 2003/0080471 (2003-05-01), Chou
patent: 2003/0080472 (2003-05-01), Chou
patent: 2004/0007799 (2004-01-01), Choi et al.
patent: 2004/0008334 (2004-01-01), Sreenivasan et al.
patent: 2004/0009673 (2004-01-01), Sreenivasan et al.
patent: 2004/0021254 (2004-02-01), Sreenivasan et al.
patent: 2004/0021866 (2004-02-01), Watts et al.
patent: 2004/0022888 (2004-02-01), Sreenivasan et al.
patent: 2004/0029041 (2004-02-01), Shih et al.
patent: 2004/0036201 (2004-02-01), Chou et al.
patent: 2004/0046288 (2004-03-01), Chou
patent: 2004/0110856 (2004-06-01), Young et al.
patent: 2004/0118809 (2004-06-01), Chou et al.
patent: 2004/0124566 (2004-07-01), Sreenivasan et al.
patent: 2004/0131718 (2004-07-01), Chou et al.
patent: 2004/0137734 (2004-07-01), Chou et al.
patent: 2004/0156108 (2004-08-01), Chou et al.
patent: 2004/0188381 (2004-09-01), Sreenivasan
patent: 2004/0192041 (2004-09-01), Jeong et al.
patent: 2004/0197843 (2004-10-01), Chou et al.
patent: 2004/0211754 (2004-10-01), Sreenivasan
patent: 2004/0224261 (2004-11-01), Resnick et al.
patent: 2004/0250945 (2004-12-01), Zheng et al.
patent: 2005/0037143 (2005-02-01), Chou et al.
patent: 1-196749 (1989-08-01), None
patent: 02-24848 (1990-01-01), None
patent: 02-92603 (1990-04-01), None
patent: 02192045 (1990-07-01), None
patent: WO 87/02935 (1987-05-01), None
patent: WO 99/05724 (1999-02-01), None
patent: WO 00/21689 (2000-04-01), None
patent: WO 01/47003 (2001-06-01), None
patent: WO 02/07199 (2002-01-01), None
patent: WO 03/010289 (2003-02-01), None
patent: WO 03/079416 (2003-09-01), None
patent: WO 03/099536 (2003-12-01), None
patent: WO 2004/114016 (2004-12-01), None
patent: WO 2005/031299 (2005-04-01), None
patent: WO 2005/031855 (2005-04-01), None
Feynman, There's Plenty of Room at the Bottom, Dec. 1, 1959.
Kotachi et al., Si-Containing Positive Resist for ArF Excimer Laser Lithography, Photopolymer Science and Technology, pp. 615-622 Nov. 4, 1995.
Xia et al., Soft Lithography, Angew. Chem. Int. Ed., pp. 550-575 Jan. 1, 1998.
Lin, Multi-Layer Resist Systems, Introduction to Microlithography, pp. 287-349 Feb. 14, 1983.
Nguyen, Asymmetric Fluid-Structure Dynamics in Nanoscale Imprint Lithography, The University of Texas at Austin, pp. 1-111 Aug. 1, 2001.
Nerac.com Retro Search, Reduction of Dimension of Contact Holes, Aug. 31, 2004.
Nerac.com Retro Search, Trim Etching of Features Formed on an Organic Layer, Sep. 2, 2004.
Nerac.com Retro Search, Multi-Layer Resists, Sep. 2, 2004.
Abstract of Japanese Patent 02-92603, Aug. 12, 2004.
Abstract of Japanese Patent 02-24848, Jan. 26, 1990.
Luurtsema, Spin Coating for Rectangular Substrates, Retrieved May 23, 2002 from URL: http://buffy.eecs.berkelye.edu/IRO/Summary/97abstracts/gluurts.2.html May 23, 2002.
Photoresist Coating Methods, e-mail from Susan Bagen (BAGEN@aol.com) to Dhaval Shah Sep. 18, 1987.
Nakamatsu et al., Bilayer Resist Method for Room-Temperature Nanoimprint Lithography, Japanese Journal of Applied Physics, vol. 43, No. 6B, pp. 4050-4053 Jun. 29, 2004.
Data Sheet for MAK (Methyl n-Amyl Ketone), www.sp-chem.com/fine—e Jan. 1, 2003.
Data Sheet for gamma-Glycidoxypropyltrimethoxysilane, www.powerchemical.net/3100.htm Dec. 5, 2003.
Silicon or Silica, www.mii.org/Minerals/photosil Mar. 31, 2005.
Electronic Devices and Circuits, people.deas.harvard.edu/˜jones/es154/lectures/lecture—2/materials/materials.html Mar. 31, 2005.
Data Sheet for Cymel 303ULF, www.cytec.com.
Data Sheet for Cycat 4040, www.cytec.com
International Chemical Safet

Affiliated with

Also associated with

Rating

Method of forming a recessed structure employing a reverse... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming a recessed structure employing a reverse..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a recessed structure employing a reverse... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3734633