Method of forming a pattern, method of forming wiring,...

Details Method of forming a pattern, method of forming wiring,... Method of forming a pattern, method of forming wiring,...

2005-09-21

2008-09-30

Sarkar, Asok K (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S072000, C257SE21174, C257SE21582

Reexamination Certificate

active

07429530

ABSTRACT:
A method of forming a pattern of a functional layer on a surface of a substrate, where a pattern region, to which the pattern is provided, is edged with a boundary layer, and has a first region and a second region communicated with the first region and having a narrower width than the first region, the method includes: providing an intermediate layer having adhesiveness with the substrate and lyophilicity with a functional fluid to the first and the second regions; ejecting a droplet of the functional fluid to the first region; and allowing the droplet of the functional fluid ejected to the first region to automatically flow to the second region with the lyophilicity with the intermediate layer.

REFERENCES:
patent: 6303963 (2001-10-01), Ohtani et al.
patent: 7119026 (2006-10-01), Honda et al.
patent: 7129166 (2006-10-01), Speakman
patent: 2004/0048001 (2004-03-01), Kiguchi et al.
patent: 2005/0242394 (2005-11-01), Nakabayashi et al.
patent: 2003-315813 (2003-11-01), None
patent: 2004-095896 (2004-03-01), None

Affiliated with

Also associated with

Rating

Method of forming a pattern, method of forming wiring,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming a pattern, method of forming wiring,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a pattern, method of forming wiring,... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3988601