Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-09-25
1993-08-17
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156643, 156646, 156657, 156662, 437225, 437233, 437234, 437 3, 437 4, 437 5, H01L 2100
Patent
active
052365476
ABSTRACT:
In a method of forming a pattern in semiconductor device manufacturing process, a thin film consisting of a silicon nitride film is formed on a substrate. Ga ions are implanted by a focussed ion beam into a selected region of the thin film. At this point, a pattern to be formed is defined by the selected region. Subsequently, the thin film is dry etched by CF.sub.4. At this point, the selected region into which the ions are implanted functions as an etching inhibition region.
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Hinkel et al, "Method of Influencing the Etch Rate of PECVD Films and Application of the Method", IBM Technical Disclosure Bulletin, vol. 24, No. 11B, Apr. 1982.
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Wang et al: "Vacuum lithography for in situ fabrication of . . . ".
Shiraki Yasuhiro
Takahashi Shigeki
Dang Thi
Kabushiki Kaisha Toshiba
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