Method of forming a package with exposed component surfaces

Details Method of forming a package with exposed component surfaces Method of forming a package with exposed component surfaces

2008-09-29

2010-10-26

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257SE21502

Reexamination Certificate

active

07820485

ABSTRACT:
A method of forming a semiconductor package includes forming a coating over a first device, attaching the first device to a substrate using an adhesive, encapsulating the first device using an encapsulant material, releasing the first device from the substrate using the adhesive, removing a portion of the encapsulant material that is over the first device to expose the coating, and removing the coating over the first device to expose a portion of the first device.

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Pendse, Raj, Ph.D., “fcPiP: The Marriage of Flip Chip and Wire Bond”, STATS ChipPAC, Inc., Advanced Packaging, Oct. 2008.

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