Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1997-11-13
2000-08-29
Hamilton, Cynthia
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
522103, G03F 7028, G03F 7032
Patent
active
061106437
ABSTRACT:
In a process for fabricating a multilayer printed circuit board with permanent innerlayers of photoresist, the photo-imageable composition used to form the hard permanent layer comprises a polymerizable acrylate monomer; an oligomer formed by the reaction of an epoxy resin and an acrylic or methacrylic acid; a photosensitive, free radical generating initiator for polymerization of the acrylic monomer and oligomer; a curable epoxy resin; a curing agent for the epoxy resin; and, optionally, a crosslinking agent reactive with hydroxyl groups. After exposure and development of a layer of the photoimageable composition and etching of the underlying metal layer on a board, the resultant photoresist is left on the circuitry traces. The innerlayers of photoresist are stacked in a press where it initially conforms under heat and pressure to fill voids between the innerlayers and then cures to permanence.
REFERENCES:
patent: 5229252 (1993-07-01), Flynn et al.
Flynn Kathy M.
Koes Thomas A.
Nizzo Vincent J.
Rath James
Tara Vinai Ming
Hamilton Cynthia
Morton International Inc
LandOfFree
Method of forming a multilayer printed circuit board and product does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming a multilayer printed circuit board and product, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a multilayer printed circuit board and product will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1248087