Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2011-03-08
2011-03-08
Lee, Eugene (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C257S685000, C257SE21599, C257SE23116, C257SE23141, C438S111000, C438S123000, C438S124000, C438S127000
Reexamination Certificate
active
07901990
ABSTRACT:
In one embodiment, a method for forming a molded flat pack style package includes attaching electronic chips to an array lead frame, which includes a plurality of elongated flag portions with tab portions and a plurality of leads. The method further includes connecting the electronic chips to specific leads, and then molding the array lead frame while leaving portions of the leads exposed to form a molded array structure. The molded array structure is then separated to provide molded flat pack style packages having exposed leads for insertion mount and exposed tab portions. In an alternative embodiment, the separation step produces a no-lead configuration with exposed tab portions.
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Fauty Joseph K.
Kime Kent L.
Letterman, Jr. James P.
Gumedzoe Peniel M
Jackson Kevin B.
Lee Eugene
Semiconductor Components Industries LLC
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