Method of forming a microstructure

Details Method of forming a microstructure Method of forming a microstructure

1996-05-28

1998-09-08

Breneman, R. Bruce

Etching a substrate: processes

Etching of semiconductor material to produce an article...

216 27, 216 95, B41J 205, C23F 100

Patent

active

058040838

ABSTRACT:
Method of forming a complex, minute three-dimensional structure, known as micromachining, which includes forming a plurality of thin films at least one of which is provided as a temporary layer composed of a lower layer made of an organic material and an upper layer made of an amphoteric metal material which is formed on the lower layer; and selectively removing the temporary layer to provide a three-dimensional structure. The temporary layer may comprise a composite sacrificial layer of photoresist and aluminum.

REFERENCES:
patent: 4434224 (1984-02-01), Yoshikawa et al.
patent: 5376231 (1994-12-01), Matsumoto et al.
patent: 5478606 (1995-12-01), Ohkuma et al.
patent: 5524784 (1996-06-01), Shiba et al.
patent: 5683591 (1997-11-01), Offenberg
patent: 5698112 (1997-12-01), Naeher et al.

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