Method of forming a microelectronic package having a copper subs

Details Method of forming a microelectronic package having a copper subs Method of forming a microelectronic package having a copper subs

1991-04-10

1992-07-07

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C23C 1434

Patent

active

051280086

ABSTRACT:
Disclosed is a method of fabricating a microelectronic package having least one layer formed of a copper surface core, e.g., a copper-Invar-copper core, with a polymeric dielectric film. The method includes removing copper oxide from the copper surface of the metallic core or layer. After this step an adhesion layer, such as a chromium layer, a nickel layer, or chromium and nickel or chromium and copper bilayers, is sputter deposited onto the copper surface of metallic core or layer. A polymeric dielectric film is then applied atop the metallic adhesion layer.

REFERENCES:
patent: 3781596 (1973-12-01), Galli et al.
patent: 3853961 (1974-12-01), Birkenstock et al.
patent: 3958317 (1976-05-01), Peart et al.
patent: 4416725 (1983-11-01), Cuomo et al.
patent: 4524089 (1985-06-01), Haque et al.
patent: 4588641 (1986-05-01), Haque et al.
patent: 4863808 (1989-09-01), Sallo
patent: 4902551 (1990-02-01), Nakaso et al.
patent: 4917963 (1990-04-01), Kittler

Affiliated with

Also associated with

Rating

Method of forming a microelectronic package having a copper subs does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming a microelectronic package having a copper subs, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a microelectronic package having a copper subs will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1827621