Method of forming a metal silicide layer, devices...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S624000, C257SE21585

Reexamination Certificate

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07851353

ABSTRACT:
Methods of forming metal silicide layers. The methods include: forming a silicon-rich layer between dielectric layers; contacting the silicon-rich layer with a metal layer and heating the silicon rich-layer and the metal layer to diffuse metal atoms from the metal layer into the silicon layer to form a metal silicide layer.

REFERENCES:
patent: 6051475 (2000-04-01), Ho et al.
patent: 6638816 (2003-10-01), Wakabayashi
patent: 6720603 (2004-04-01), Iijima et al.
patent: 7179739 (2007-02-01), Choi et al.
patent: 7273779 (2007-09-01), Fishburn et al.
patent: 7273781 (2007-09-01), Lee
patent: 7276751 (2007-10-01), Ho et al.
patent: 2007/0197032 (2007-08-01), Owada et al.

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