Method of forming a metal pattern on a substrate

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

Reexamination Certificate

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C430S315000

Reexamination Certificate

active

10820236

ABSTRACT:
The invention relates to a method of providing two distinct photoimageable film compositions, in particular, two distinct dry film compositions, on a substrate. Each of the two photoimageable film compositions is selected to have a different developing speed and/or curing speed so that, after development, the top layer of photoimageable film overhangs the bottom layer of photoimageable film. A metal layer is subsequently deposited over the surface of the substrate. The overhang allows for the clean removal of the photoimageable film layers, without damage to the subsequently applied metal layer, because the overhang prevents the metal layer from making intimate contact with the photoimageable film layers along the interface of the substrate with the photoimageable film layers.

REFERENCES:
patent: 4035320 (1977-07-01), Lawson
patent: 4413051 (1983-11-01), Thomas
patent: 4582778 (1986-04-01), Sullivan
patent: 4804615 (1989-02-01), Larson et al.
patent: 4866008 (1989-09-01), Brighton et al.
patent: 4882245 (1989-11-01), Gelorme et al.
patent: 5359928 (1994-11-01), Blessington et al.
patent: 5374503 (1994-12-01), Sachdev et al.
patent: 5733466 (1998-03-01), Benebo et al.
patent: 5758412 (1998-06-01), Knopp
patent: 5766967 (1998-06-01), Lai et al.
patent: 5922517 (1999-07-01), Bhatt et al.
patent: 6044550 (2000-04-01), Larson
patent: 6255035 (2001-07-01), Minter et al.
patent: 6383401 (2002-05-01), Labzentis et al.
patent: 6423463 (2002-07-01), Oota et al.
patent: 6515233 (2003-02-01), Labzentis et al.

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