Method of forming a lead frame

Details Method of forming a lead frame Method of forming a lead frame

1986-06-17

1987-11-03

Bashore, S. Leon

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156654, 156901, 29827, 357 70, B44C 122, H01R 4300, H01L 2348

Patent

active

047041870

ABSTRACT:
In a lead frame for a semiconductor device, inner leads are formed by etching and outer leads are formed by pressing.

REFERENCES:
patent: 3537175 (1970-11-01), Clair et al.

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