Method of forming a layer of material from a solution

Stock material or miscellaneous articles – Metal continuous phase interengaged with nonmetal continuous...

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34 12, 156 87, 156245, 156102, 156246, 210500M, 264 86, 264 87, 427372B, 428920, 428921, 428432, B32B 904, B32B 3100

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041918053

ABSTRACT:
A method of forming a layer of material from a solution containing the material and a solvent which comprises the steps of forming the solution into a layer, contacting at least one major face of the solution layer with a wall which is permeable over the area of that face substantially to the vapor phase only of the solvent, and effecting the escape of solvent simultaneously from both major faces of the layer including the one major face by vapor diffusion through the wall so as to set the layer.

REFERENCES:
patent: 2383694 (1945-08-01), Steiner
patent: 2894855 (1959-07-01), Wilhelm et al.
patent: 3112235 (1963-11-01), Blanchard
patent: 3238078 (1966-03-01), Baldwin
patent: 3259536 (1966-07-01), Gaeth et al.
patent: 3342729 (1967-09-01), Strand
patent: 3641229 (1972-02-01), Lawrence et al.
patent: 3686116 (1972-08-01), Rio
patent: 3762566 (1973-10-01), Del Pico
patent: 3763055 (1973-10-01), White et al.
patent: 3767502 (1973-10-01), Ishii et al.
patent: 3864289 (1975-02-01), Randall
patent: 3974316 (1976-08-01), Jacquemin et al.

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