System and method for tasking processing modules based upon temp

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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Details

324763, 324765, 377 25, 374102, 374183, 374184, 374170, 374178, 374179, G01R 2726, G01K 102, G01K 300, G01K 700

Patent

active

060912553

ABSTRACT:
An on-chip thermometer and methods for using the on-chip thermometer to measure a local temperature and to operate an integrated circuit. The on-chip thermometer comprises a clock circuit, a temperature responsive circuit, and a counter. The clock circuit operates at a fixed frequency and generates a fixed frequency clock signal. The temperature responsive circuit, when enabled, generates a signal dependent on local temperature. In response to receiving the clock signal, the temperature responsive circuit generates an output signal. The counter is coupled to receive the output signal from the temperature responsive circuit and the clock signal. The counter then generates a value indicative of a local temperature of the integrated circuit. A method of measuring a local temperature on an integrated circuit comprises generating a clock signal at a fixed frequency, providing the clock signal to a temperature responsive circuit, the temperature responsive circuit generating an oscillating signal comprising a plurality of oscillations dependent on a local temperature of the integrated circuit in response to receiving the clock signal, and counting the oscillations to generate a value indicative of the local temperature. On an integrated circuit including a plurality of processing modules located at respective locations with a plurality of on-chip thermometers, a task delegation module is coupled to each of the on-chip thermometers and the processing modules. Each on-chip thermometer generates a value indicative of a local temperature. The task delegation module receives output values from the on-chip thermometers and assigns processing tasks to the processing modules based on the local temperatures at each respective location.

REFERENCES:
patent: 5406212 (1995-04-01), Hashinaga
patent: 5473259 (1995-12-01), Takeda
patent: 5513235 (1996-04-01), Douglass

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