Method of forming a copper circuit pattern

Details Method of forming a copper circuit pattern Method of forming a copper circuit pattern

1992-09-29

1993-09-07

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 1566591, 156666, 156901, 205103, 205125, B44C 122, C23F 100

Patent

active

052425355

ABSTRACT:
A method of forming a copper circuit pattern on a ceramic substrate. In accordance with the method, first and second layers of copper oxide and copper are applied to the ceramic substrate. Selected regions of the copper are then masked so that unmasked regions are formed on the copper in a configuration of the copper circuit pattern. Masked regions are formed on the copper adjacent the unmasked regions, where copper cannot be plated. The unmasked regions of the copper are plated in a neutral pH solution by a reverse pulse plating process. The masking is then removed and the copper and copper oxide layers are etched so that the copper and copper oxide is removed from the unmasked regions. Thereafter, the remaining copper is direct bonded to the substrate.

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patent: 4606788 (1986-08-01), Moran
patent: 4657778 (1987-04-01), Moran
patent: 4853277 (1989-08-01), Chant
patent: 4987677 (1991-01-01), Tanaka et al.
patent: 5036167 (1991-07-01), Kasai

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